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Not in the same orientation. Package, pin numbering, electrical ratings and PoE rating all match, but the drawings label the sides oppositely: on the WHDG96503PTG pins 1–48 are the cable side and 49–96 the chip side, and on theWHDG96502PTGit is the reverse.
Swapping the part straight in puts the PHY side against the cable side. On a board already routed for one of them, the other needs its orientation re-checked — changing the part number alone is not enough.
A component figure. The WHDG96503PTG drawing annotates the operating temperature line as including the part's own temperature rise, so self-heating is already inside the range.
Thermal design can therefore compare against the measured component temperature directly, without setting aside a further margin on top. Other parts in the100/1000 BASE-T rangedo not carry that annotation, so the conclusion should not be carried across to them.
Solder wave at 255 °C to 265 °C with a dwell of 3.0 to 5.0 s.
Preheat runs at 100 °C to 110 °C for 60 to 90 s; after the wave the part comes down below 90 °C within 30 to 50 s, with the ramp rate held to 5 °C per second. The WHDG96503PTG is a through-hole part and needs no line change beyond running this profile. Surface-mount alternatives sit in the100/1000 BASE-T range.