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VOOHU WH81177C00021 Replaces Molex 2027180100 — QSFP-DD High-Speed Connector Comparison

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2026.Jul.10

VOOHU WH81177C00021 Replaces Molex 2027180100 — QSFP-DD High-Speed Connector Comparison

1. Competitor Product Overview (Molex, LLC)

Molex, LLC is a leading global supplier of connectors and interconnect solutions spanning high-speed I/O, optical, automotive and industrial markets. The referenced Molex 2027180100 belongs to its High-Speed I/O series 202718 and is a QSFP-DD surface-mount connector (receptacle): 76 circuits, 56 Gbps per lane, right-angle SMT termination, 0.760µm gold mating-area plating and 2.540µm tin termination, a high-temperature thermoplastic housing (UL 94V-0, black), operating temperature -25°C to +65°C, 100 mating cycles, 2.0A maximum current per contact and 30V AC (RMS) maximum voltage, compliant with EU RoHS and low-halogen requirements. This part number is marked Obsolete in the Molex datasheet.

2. VOOHU Replacement Overview (Suzhou VOOHU Electronic Technology Co., Ltd.)

Suzhou VOOHU Electronic Technology Co., Ltd. specializes in the R&D and manufacture of Ethernet connectors, magnetics and high-speed interconnect products. WH81177C00021 is VOOHU's QSFP-DD 1×N surface-mount connector (receptacle) in a 76-pin, right-angle SMT configuration, aligned with the Molex 2027180100 on key specifications: an LCP housing/IMLA (UL 94V-0, black), C7025 contacts, C2680 hold-down blades and a SUS304 ground shell; plating of 1.27µm (50µ″) nickel underplate overall, 0.76µm (30µ″) gold on the mating area and 2.54µm (100µ″) matte tin on the solder area; rated 0.5A on signal pins and 1.5A on power pins, meeting RoHS and halogen-free requirements. As an in-production part, it serves as a pin-to-pin replacement candidate for the discontinued Molex 2027180100.

3. Key Parameter Comparison

The table below uses the Molex 2027180100 datasheet parameters as the baseline, with the corresponding VOOHU WH81177C00021 specifications filled in. Only parameters specified by both and matchable one-to-one are listed; items stated by only one side (data rate, operating temperature, mating cycles, etc.) are addressed in the Notes.

Parameter Molex 2027180100 (baseline) VOOHU WH81177C00021
Connector type / interface QSFP-DD surface-mount connector (receptacle) QSFP-DD 1×N surface-mount connector (receptacle)
Circuits / pins 76 76
Termination Surface mount (SMT) Surface mount (SMT)
Orientation Right angle Right angle
Mating-area plating (gold) 0.760µm gold (Au) 0.76µm (30µ″) gold (Au)
Termination plating 2.540µm tin (Sn) 2.54µm (100µ″) matte tin
Contact base material Copper alloy Copper alloy C7025
Housing / insulator High-temperature thermoplastic, black LCP (UL 94V-0), black
Flammability rating UL 94V-0 UL 94V-0
Part attribute Female / receptacle Receptacle
Environmental compliance EU RoHS compliant, low-halogen RoHS compliant, halogen-free

Notes:

  1. Supply status: the Molex 2027180100 datasheet marks the part as Obsolete; VOOHU WH81177C00021 is an in-production part and can serve as an alternative source for the discontinued type.
  2. Current ratings are defined differently: Molex specifies 2.0A maximum per contact, while VOOHU specifies 0.5A/pin on signal pins and 1.5A/pin on power pins. Because the definitions differ, this item is not forced into the table; verify signal vs. power pins separately during selection.
  3. Data rate: Molex specifies 56 Gbps per lane (PAM4); the VOOHU drawing does not state a rate directly. Both share the QSFP-DD MSA interface with identical mechanical and pin definitions and can support 200G/400G/800G (8×56G) interconnect; request a test report from VOOHU to confirm the rate grade.
  4. Contact pitch: Molex specifies 0.80mm; VOOHU follows the QSFP-DD standard layout (0.35×1.60mm pads, 76 pins) consistent with 0.80mm pitch, dimensioning the pad geometry rather than labeling the pitch value directly.
  5. Operating temperature: Molex specifies -25°C to +65°C; the VOOHU drawing does not state an operating temperature and should be confirmed with VOOHU (not assumed here).
  6. Mating cycles (durability): Molex specifies 100 cycles; the VOOHU drawing does not state a value and should be confirmed separately.
  7. Maximum voltage: Molex specifies 30V AC (RMS); the VOOHU drawing does not state a value.
  8. Plating stack: the VOOHU drawing gives the full stack — 1.27µm (50µ″) nickel underplate overall, 0.76µm (30µ″) gold on the mating area, 2.54µm (100µ″) matte tin on the solder area, and hold-down blades of 2.54µm matte tin over 1.27µm nickel; the Molex datasheet lists only the minimum 0.760µm gold on the mating area and 2.540µm tin on the termination, matching VOOHU on both layers.
  9. Structural materials: VOOHU explicitly specifies an LCP (UL 94V-0) housing/IMLA, C7025 contacts, C2680 hold-down blades and a SUS304 ground shell; the Molex datasheet lists a high-temperature thermoplastic housing, copper-alloy metal and tin termination without itemizing specific grades.
  10. This comparison is based on the published parameters of the two datasheets; pin definition / footprint compatibility, plating and final mechanical fit should be confirmed with physical samples and a joint drawing sign-off.

4. Applications

  1. QSFP-DD optical/copper module interfaces on 400G/800G data-center switches, routers and line cards.
  2. Board-level high-speed interconnect for AI/HPC servers, GPU clusters and high-speed NICs.
  3. High-density port aggregation and backplane/cable connections in telecom and cloud infrastructure.
  4. Host-side receptacles for optical modules and DAC/AOC active cables.
  5. Replacing the discontinued Molex 2027180100 to sustain supply and maintenance of existing QSFP-DD designs.

5. FAQ

Q1: Can VOOHU WH81177C00021 directly replace the discontinued Molex 2027180100?

Both are QSFP-DD 76-circuit right-angle SMT receptacles with matching key parameters — 0.76µm gold mating area, 2.54µm matte-tin termination and UL 94V-0 housing — making it a valid pin-to-pin replacement candidate. Validate soldering and mating fit with samples before mass-production rollout.

Q2: Is the gold plating thickness the same?

Yes. Molex specifies a minimum 0.760µm gold on the mating area; VOOHU specifies 0.76µm (30µ″) gold with a 1.27µm nickel underplate, aligning contact reliability.

Q3: What are VOOHU's operating temperature and rate grade?

The drawing does not state operating temperature or rate directly; the product targets QSFP-DD (8×56G) high-speed applications. Contact VOOHU for a test report on the exact temperature/rate grade — we do not assume unstated parameters.

Q4: Are samples available and what is the lead time?

Yes. Sample orders generally ship within 48 hours and arrive within 7 days, with support for customization and fast small-batch delivery. Technical support: song.lei@voohu.cn.

Why VOOHU?

One-stop sourcing: connectors + magnetics + interface chips, full support from selection to small-batch production.

Custom solutions: just share your application requirements and budget to get a tailored solution with professional technical support.

Fast development: direct from the manufacturer, rapid FAE response, efficient sampling, shorter time-to-market.

Core qualifications: ISO9001, ISO14001, RoHS, REACH; two in-house factories ensure delivery and quality.

For more information, visit VOOHU: China www.voohu.cn | Overseas www.voohuele.com | Technical support: song.lei@voohu.cn

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