WHLC-3216A-600M0 100/1000BASE-T Cap+CMC Size3216（1206）L(μH)60 non-PoE Chip LAN
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Capacitive CHIP LAN (a capacitor-based chip-type LAN transformer) uses high-precision coupling capacitors in place of traditional magnetic-core coils to achieve signal isolation and impedance matching.
1. Key advantages: extremely small size (down to 1.6×0.8mm), support for ultra-high rates (10Gbps+), lower cost, and no need for magnetic materials.
2. Limitations: it transmits only AC signals, so DC-balanced coding is constrained; poor low-frequency response (typically >100kHz); common-mode rejection ratio and surge protection are weaker than traditional transformers; and it is sensitive to ESD.
3. Applicable scenarios: consumer electronics with extremely limited space (e.g., ultra-thin laptops, phone docking stations), high-speed short-reach interconnects (server backplanes, optical modules), and cost-sensitive IoT devices. It is not suitable for industrial field sites, PoE power delivery, or long-distance outdoor use that require strong isolation and interference immunity.
Capacitive CHIP LAN uses capacitive coupling to achieve Ethernet isolation. Compared with the magnetic-coupling approach of traditional magnetic transformers, the key differences are: the former transmits AC signals through high-voltage capacitors, offering higher integration (achievable on a single chip), lower package height, better high-frequency characteristics, and immunity to magnetic-field interference—but it cannot transmit DC (and therefore does not support PoE). The latter relies on inductive magnetic-core coupling; it is larger and prone to saturation under magnetic fields, but it can simultaneously isolate DC power and is naturally compatible with PoE.
(1) Place DC-blocking capacitors (typically 0.1μF) in series at the input and output to prevent DC bias from affecting coupling accuracy. (2) Signal traces must strictly maintain 100Ω differential impedance, be kept as short as possible, and reference a complete ground plane. (3) Add a common-mode choke on the PHY-facing side of the CHIP LAN to compensate for its insufficient CMRR. (4) Add ESD protection diodes (e.g., the TLP series), because CHIP LAN itself has weak ESD immunity. (5) Avoid using it where isolation voltages above 500V are required, otherwise there is a breakdown risk.
Capacitive CHIP LAN has a relatively weak common-mode rejection ratio (CMRR) and poor common-mode interference immunity. Adding a common-mode choke compensates for this EMC weakness, suppresses common-mode noise, and improves immunity to ESD and radiated disturbances.
